F2012‐20‐12.5,32.768KHZ晶體,2012mm,FCD-Tech時(shí)鐘晶振,F2012系列,荷蘭進(jìn)口晶體,進(jìn)口音叉晶振,無源貼片晶振,兩腳貼片晶振,超薄型晶體諧振器,2012mm小尺寸晶振,SMD晶振,32.768KHZ貼片晶體,尺寸2.0x1.2mm,頻率32.768KHZ,負(fù)載12.5pF,低老化晶振,高性能晶振,高品質(zhì)晶振,工業(yè)設(shè)備晶振,無線應(yīng)用晶振,小型設(shè)備晶振,時(shí)鐘電子晶振.
F2012‐20‐12.5,32.768KHZ晶體,2012mm,FCD-Tech時(shí)鐘晶振,F2012系列特點(diǎn):
微型陶瓷SMD無源晶體封裝，2個(gè)焊盤（可回流）
溫度范圍-40/+85°C（工業(yè)應(yīng)用）
UUtra薄厚度0.6mm
優(yōu)異的老化特性
應(yīng)用：無線、商用和工業(yè)設(shè)備.
F2012‐20‐12.5,32.768KHZ晶體,2012mm,FCD-Tech時(shí)鐘晶振,F2012系列 參數(shù)表
| Parameter | min. | typ. | max. | Unit | Condi?on | ||||||||||
| Frequency | 32.768 | KHz | |||||||||||||
| Vibra?on mode | XY‐cut | ||||||||||||||
| Frequency stability | |||||||||||||||
| Ini?al tolerance @25°C | ±20, ±50 | ppm | |||||||||||||
| Opera?ng temperature range | ‐40 | +85 | °C | ||||||||||||
|
Turnover temperature Parabolic curvature constant |
25°C±5 °C ‐0.045x10‐6/°C2max. |
||||||||||||||
| Equivalent Series Resistance (ESR) | 90K? max. | ||||||||||||||
| Load Capacitance (CL) | Standard: 12.5pF ( 9pF, 7pF op?onal) | ||||||||||||||
| Shunt Capacitance (Co) | 2.0 | pF | |||||||||||||
| Drive Level | 0.1 | µW | |||||||||||||
| Aging | ±3 | ppm | At 25°C, ?rst year | ||||||||||||
| Insula?on Resistance | 500 | M? | @ 100Vdc | ||||||||||||
| Enclosure (see drawing)(LxWxH) | 2.0 x 1.2 x 0.6 | mm | |||||||||||||
| Packing | 3000 pcs per reel | ||||||||||||||
F2012‐20‐12.5,32.768KHZ晶體,2012mm,FCD-Tech時(shí)鐘晶振,F2012系列 尺寸圖
西鐵城晶振,32.768K,CM200C晶振,CM200C32768DZCT晶振
TXC晶振,貼片晶振,7M晶振
JTX310,Q 0.032768-JTX310-12.5-20-T1-HMR-LF,3215mm,Jauch晶振
ECS-360-S-20A-F-TR,ECS無源晶振,CSM-8A,以太網(wǎng)晶振
FC4SDCBMF12.288-T1,12.288MHz,FOX高質(zhì)量晶振,SMD石英晶體
FC5AQBBME18.0-T1,FOX晶振廠家,5032mm,兩腳貼片晶振
